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'AirPods 3' to adopt SiP technology similar to AirPods Pro, Kuo says

Apple’s next-generation in-ear AirPods product will move to a more complex system-in-package chip solution, replacing surface mount technology used in current versions of the device, according to TF Securities analyst Ming-Chi Kuo.Compared to SMT technology, SiP systems typically enable manufacturers to pack more components into a smaller space. Apple’s AirPods Pro, for example, employs an SiP design with an Apple-designed H1 chip that handles audio, Siri commands, noise-cancelling capabilities and more.The Cupertino tech giant will introduce the chip packaging technology in its entry-level AirPods product for the first time in 2021, Kuo said in a research note Monday. What, exactly, that means for end users remains unclear, though it could herald a trickle down effect for more advanced features enjoyed by owners of the Pro designated variant. Read more…
Source: Apple Insider News and Secrets on New Apple Products

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